Custom Design and Engineering of Electronic Components and Assemblies
eComp can help you create a design for legacy components that have been discontinued or are moving toward obsolescence. Changes or additions to functionality or packaging can be included in the design so they perfectly meet your needs.
Whether it’s semiconductor components (wafer, die and packaged), custom hybrids, FPGA designs, circuit optimization, device drivers, specialty electronic products or a complete turn-key solution, eComp is here for you.
Packing and screening services
Wafer sub contract processing
Board Reduction PCB
Create new design
Silicon 360 Div of STS
Vanteon Electronic Design